JPH01137584U - - Google Patents
Info
- Publication number
- JPH01137584U JPH01137584U JP3340088U JP3340088U JPH01137584U JP H01137584 U JPH01137584 U JP H01137584U JP 3340088 U JP3340088 U JP 3340088U JP 3340088 U JP3340088 U JP 3340088U JP H01137584 U JPH01137584 U JP H01137584U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor integrated
- panel
- switch element
- lead terminal
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Input From Keyboards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3340088U JPH071817Y2 (ja) | 1988-03-14 | 1988-03-14 | 半導体集積回路実装機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3340088U JPH071817Y2 (ja) | 1988-03-14 | 1988-03-14 | 半導体集積回路実装機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01137584U true JPH01137584U (en]) | 1989-09-20 |
| JPH071817Y2 JPH071817Y2 (ja) | 1995-01-18 |
Family
ID=31260080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3340088U Expired - Lifetime JPH071817Y2 (ja) | 1988-03-14 | 1988-03-14 | 半導体集積回路実装機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071817Y2 (en]) |
-
1988
- 1988-03-14 JP JP3340088U patent/JPH071817Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH071817Y2 (ja) | 1995-01-18 |